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曾博川 Bochuan Zeng

2023 - present (looking for job opportunity)

Shenzhen University

I’m looking for job opportunity. Please reach me if you are interest!

Email: 2546542875@qq.com

Publications and Patents:

[1] Weidan Xiong, Bochuan Zeng, Ziyu Hu, Jianwei Guo, Ke Xie, Hui Huang*. “Aerial Path Planning for Urban Geometry and Texture Co-Capture”. ACM Transactions on Graphics (Proceedings of SIGGRAPH Asia 2025). (CCF-A, JCR Q1)

[2] Weidan Xiong, Yongli Wu, Bochaun Zeng, Jianwei Guo, Dani Lischinski, Daniel Cohen-Or, Hui Huang*. “DiffTex: Differentiable Texturing for Architectural Proxy Models”. ACM Transactions on Graphics (Proceedings of SIGGRAPH Asia 2025). (CCF-A, JCR Q1)

[3] “一种无人机路径规划方法、装置、终端及存储介质”, 发明专利, 2024.

[4] “用于重建结构化模型几何与纹理的无人机路径规划软件”, 软件著作权, 2024.

Experience:

2025.06-2025.09: Intern at Huawei Ltd (Shenzhen).

2024.09-2025.01: Teaching Assistant of Computer Graphics.